Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

Solder joints in microelectronic are used for electrical signals transmission, heat conduction and structural support. One of the key problems referring to solders in microelectronics is reliability due to typical failure modes as creep and fatigue. The above paper focuses on the experimental measurements and corresponding analysis with the microindentation tests of the SAC 405 solder alloy due...

Residual stress prediction for microelectronic packaging materials

At cure temperatures below Tg the cure shrinkage contributes significantly to residual stress build-up. Residual stresses in a flip chip package The cure shrinkage model was implemented in FE code. In figures 2 and 3 the residual stress build-up for a 2D plane strain model of an adhesively bonded flip chip is shown. A schematic representation of the model is given in the inset of figure 3. For ...

Use of vitrified urban incinerator waste as raw material for production of sintered glass - ceramics

The crystallisation behaviour of vitrified industrial waste (fly ash from domiciliary solid waste incineration) was examined by differential thermal analysis, X-ray diffractometry and scanning electron microscopy. It was demonstrated that powder processing route was required to transform the vitrified industrial waste into glass-ceramics products. Time-Temperature-Transformation (TTT) diagrams ...

When are research findings ready for use?

Micromachined Flexible Interconnect for Wafer Level Packaging

Wafer Level Packaging (WLP) of microelectronic circuitry, in which critical package elements are formed on the silicon wafer prior to dicing, has several advantages over conventional packaging techniques, such as one-step testability of multiple chips on a silicon wafer prior to dicing, and the possibility of high input-output (I/O) density. One of the critical elements of WLP is the interconne...